A simple and robust model to explain convex corner undercutting in wet bulk micromachining
نویسندگان
چکیده
منابع مشابه
A comprehensive review on convex and concave corners in silicon bulk micromachining based on anisotropic wet chemical etching
Wet anisotropic etching based silicon micromachining is an important technique to fabricate freestanding (e.g. cantilever) and fixed (e.g. cavity) structures on different orientation silicon wafers for various applications in microelectromechanical systems (MEMS). {111} planes are the slowest etch rate plane in all kinds of anisotropic etchants and therefore, a prolonged etching always leads to...
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Bulk silicon etching techniques, used to selectively remove silicon from substrates, have been broadly applied in the fabrication of micromachined sensors, actuators, and structures. Despite the more recent emergence of higher resolution, surfacemicromachining approaches, the majority of currently shipping silicon sensors are made using bulk etching. Particularly in light of newly introduced dr...
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متن کاملConvex Corner Undercutting of {100} Silicon in Anisotropic KOH Etching: The New Step-Flow Model of 3-D Structuring and First Simulation Results
In this paper, the mechanism of convex corner (CC) undercutting of Si 100 in pure aqueous KOH solutions is revisited by proposing the step-flow model of 3-D structuring as a proper description of the observed phenomena. The basic idea is to conceive the Si 100 anisotropic etching process, on the atomic scale, as a “peeling” process of terraced {111} planes at 110 oriented steps to understand al...
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ژورنال
عنوان ژورنال: Micro and Nano Systems Letters
سال: 2013
ISSN: 2213-9621
DOI: 10.1186/2213-9621-1-1